BLS8 Sponsorship & Exhibitor Packages
We would like to welcome Sponsors and Exhibitors to join BLS8 in Tokyo, Japan. BLS8 will be held face-to-face and online. The organizing committee expects at least 400 researchers, engineers, and technicians will visit Tokyo to discuss their findings and exchange ideas on biologging technologies.
Sponsorship & Exhibition Benefits
BLS8 is the best opportunity to increase awareness of your company and promote your products and service. Your investment in BLS8 will help us bring scientists from around the world to engage in interdisciplinary and intercultural exchanges. We are raising funds for all aspects of the symposium, from the general program to special events and receptions. Below we describe a number of ways you can support BLS8.
BLS8 Sponsorship levels
All sponsorship packages include an acknowledgement on the conference website with a logo link to your organization's website.
2 spaces for exhibition, 1 oral presentation, Advertisement in abstract, Logo in HP, Six conference registration, Banquet invitation for three participants
1 space for exhibition, 1 oral presentation, Advertisement in abstract, Logo in HP, Three conference registration
Advertisement in abstract, Logo in HP, One conference registration
One special sponsorship benefit in BLS8 is ‘sponsor presentation’, where SYOGUN and DAIMYO sponsors have an opportunity of a short (<5 min., to be determined) oral presentation about their products, in the main session of the symposium.
If you have any enquiries or ideas on other support (e.g., in-kind support, awards, specific support for coffee service), please contact with Local Organizing Committee (bls8tokyo_at_gmail.com)
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BLS8 2023 Sponsorship and Exhibition Application
Company name:
Company address:
Contact name:
Contact Email:
Sponsorship levels (select one):
SYOGUN (¥1,000,000)/ DAIMYO (¥500,000)/ SAMURAI (¥200,000)
Amount: ¥
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Please complete the above form and send to bls8tokyo_at_gmail.com. We will notify you about the payment details upon receipt of the form.